The board may issue bonds to pay the following:

1. (1) The cost of the works that are provided in the district plan.
2. (2) Necessary engineering, legal, and administrative fees.

3. (3) The repayment or refinancing of a loan.

   [Pre-1995 Recodification Citation: 13-3-3-81 part.]

As added by P.L.1-1995, SEC.26.